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标题: Flip chip封装的bump到PCB的寄生該怎么考慮？ [打印本页]

作者: 糊捡掏 时间: 2020-3-31 20:34
标题: Flip chip封装的bump到PCB的寄生該怎么考慮？
文章简介：各位前辈，小弟最近在做一个微波芯片，计划使用flipchip的封装形式，

各位前辈，小弟最近在做一个微波芯片，计划使用flip chip的封装形式，可是不知道该怎么考虑flip chip的bump的寄生电感、寄生电阻等的大小，在仿真的时候该怎么在电路中添加相应的器件来模拟封装，不知道有没有有经验的前辈赐教一下，感谢感谢！！

作者: tranceblue 时间: 2020-3-31 20:35
FCBGA is very like the PCB.
except for the solder bump and BGA Ball.

You can
(a). check out the websites of the IC assembly/package suppliers for the related information.
Or, (b). by your self, do the estimation by simulation (creating the nets' traces\vias\pads..)
However, I suggest that you should take the approach (a) at first.

Then, you can get an image about the FCBGA packaging.

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